Phosphor-loaded waveguide

ABSTRACT

An improved waveguide is disclosed. The waveguide utilizes a luminescent material disposed within or around its perimeter to introduce additional light into the waveguide. For example, the waveguide may include a plurality of planar layers having different refractive indexes. A luminescent material may be disposed along the outer edge of these layers. When light from within the waveguide strikes the luminescent material, it emits light, thereby adding to the light in the waveguide. Not only does the luminescent material introduce more light into the waveguide, it also introduces more light sources, thereby making it more difficult to introduce a probe without blocking at least a portion of the light destined for the image sensor. The luminescent material may be a phosphor.

This application is a Continuation of U.S. patent application Ser. No.15/548,027 filed on Aug. 1, 2017, which is a 371 of PCT/US2016/020047filed Feb. 29, 2016, which claims priority of U.S. Provisional PatentApplication Ser. No. 62/130,208, filed Mar. 9, 2015, the disclosures ofwhich are herein incorporated by reference in their entireties.

This invention was made with Government support under Contract No.FA8721-05-C-002 awarded by the U.S. Air Force. The Government hascertain rights in the invention.

FIELD

This disclosure relates to waveguides used for physically unclonablefunctions applicable on fully functional printed circuit boards.

BACKGROUND

Security is becoming increasingly important as the internet andelectronic devices become more pervasive. For example, computers andeven mobile telephones are equipped with biometrics to prevent access byunauthorized users.

Encryption is also used to prevent unauthorized access to devices andinformation. For example, data can be encrypted before being transmittedon the internet. Other techniques, such as security tokens, are alsoemployed to limit access to devices.

In addition, many electronic systems require a unique digital identifierfor authentication, key derivation and other purposes. These electronicsystems are often manufactured using traditional manufacturingprocesses. Creating a unique digital identifier in this environment isoften difficult and time consuming. Furthermore, to be effective, theunique digital identifier should be extremely different or nearlyimpossible to determine and copy.

One method of creating this unique digital identifier is through the useof waveguides. FIG. 1 shows a cross section of a printed circuit board10 with a conventional planar waveguide 20. The printed circuit board 10includes one or more light sources 11. These light sources 11 emit lightthat enters the waveguide 20 by means of angle mirror 26 cut into thewaveguide 20. The light initially appears in both the inner core 21 andthe outer cladding 22, but an absorptive layer of material 25 absorbsthe light in the outer cladding 22. The printed circuit board 10 alsoincludes an image sensor 12, such as a CCD image sensor. Light in theinner core 21 is not coupled to the image sensor 12, but inhomogeneities27 in the inner core 21 scatter light into the outer cladding 22 wheresome fraction of this light is received by the image sensor 12. Thus,some portion of the light emitted from the light sources 11 reaches theimage sensor 12. The light pattern created on the image sensor 12 isthen converted to a digital value. Slight differences in the structureof the waveguide 20 affect the resulting light pattern, causing uniquepatterns to be reflected onto the image sensor 12. Thus, the lightpattern represents the unique identifier.

As mentioned above, these waveguides 20 are traditionally constructedusing an inner core 21 surrounded by an outer cladding 22. The outercladding 22 is then covered by a reflective silver layer 24. The innercore 21 may have a higher refractive index (n) than the outer cladding22. For example, the inner core 21 may have a refractive index of 1.59,while the outer cladding has a refractive index of 1.49. Light isreflected at the boundary between the inner core 21 and the outercladding 22 or at the boundary between the outer cladding 22 and thesilver layer 24.

As shown in FIG. 1, the incident angle of the light determines at whichboundary the light is reflected. Higher incident angle light isreflected at the boundary between the inner core 21 and the outercladding 22, while lower incident angle light is reflected at the silverlayer 24. For example, using the refractive indices described above,light with an incident angle of 70° to 90° will remain trapped in theinner core 21. Light with a lower incident angle, such as 60° to 70°,are contained within both the inner core 21 and the outer cladding 22.Further, at incident angles less than roughly 60°, the light will exitthe outer cladding 22 and may be reflected by the silver layer 24.

FIG. 2 shows a top view of the waveguide 20 of FIG. 1. Disposed underthe waveguide 20 are a light source 11 and an image sensor 12. Light isemitted from the light source 11 and traverses the waveguide 10 to theimage sensor 12. FIG. 2 also shows an intrusive probe 13 that has beeninserted into the waveguide 10. If the probe 13 is not inserted into thedirect path between the light source 11 and the image sensor 12, itsaffect on the reflected light pattern received by the image sensor 12may be minimal. For example, there may be some small amount of light 15reflected off the probe 13 that may affect the reflected pattern;however, most of the light in the waveguide 20 that is destined for theimage sensor 12 is unaffected by the probe 13. If the probe 13 is notinserted in the direct light path, the shadow 14 cast by the probe 13may have no affect on the reflected light pattern received by the imagesensor 12.

However, ideally, the light pattern should be significantly affected bythe insertion of an intrusive probe 13, regardless of the location ofthat insertion. Therefore, it would be beneficial if there were awaveguide where the reflected light pattern is more significantlyaffected by the insertion of a probe. Furthermore, it would beadvantageous if this significant change in the reflected light patternoccurred regardless of the location of the insertion.

SUMMARY

An improved waveguide is disclosed. The waveguide utilizes a luminescentmaterial disposed within or around its perimeter to introduce additionallight into the waveguide. For example, the waveguide may include aplurality of planar layers having different refractive indexes. Aluminescent material may be disposed along the outer edge of theselayers. When light from within the waveguide strikes the luminescentmaterial, it emits light, thereby adding to the light in the waveguide.Not only does the luminescent material introduce more light into thewaveguide, it also introduces more light sources, thereby making it moredifficult to introduce a probe without blocking at least a portion ofthe light destined for the image sensor. The luminescent material may bea phosphor.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the present disclosure, reference is madeto the accompanying drawings, which are incorporated herein by referenceand in which:

FIG. 1 shows a printed circuit board with a waveguide according to theprior art;

FIG. 2 shows a top view of a waveguide of the prior art with anintrusive probe inserted into the waveguide;

FIG. 3A shows a cross-sectional view of the waveguide according to oneembodiment and FIG. 3B shows a top view of the waveguide;

FIG. 4 shows the waveguide of FIG. 3 with an intrusive probe; and

FIG. 5A shows a cross-section view of the waveguide of FIG. 3A and FIG.5B shows a top view of a printed circuit board using the waveguide ofFIG. 3A.

DETAILED DESCRIPTION

The present disclosure describes a waveguide that may be used with fullyfabricated printed circuit boards to create a physically unclonablefunction. As described above, the waveguide utilizes a luminescentmaterial disposed within or around its perimeter to introduce additionallight into the waveguide. When light from within the waveguide strikesthe luminescent material, that luminescent material also emits light,thereby adding to the light in the waveguide.

FIG. 3A shows a cross-sectional view of the waveguide 100 according toone embodiment. FIG. 3B shows a top view of the waveguide 100. As shownin FIG. 3A, the waveguide 100 may include an inner core 110, which issandwiched on both sides by an outer cladding 120. In other words, thereare two layers of outer cladding 120, where one layer is disposed oneach side of the inner core 110. In another embodiment, the outercladding 120 may be applied to only one surface of the inner core 110.In yet another embodiment, the outer cladding 120 may cover only aportion of the inner core 110 on one or both sides.

In certain embodiments, the inner core 110 and the outer cladding 120may both be polymers. In certain embodiments, the inner core 110 may bea transparent material.

The two materials used in the waveguide 100 each have differentrefractive indices, with the inner core 110 having a higher index thanthe outer cladding 120. The inner core 110 and the outer cladding 120meet at an inner interface 115.

Each of the layers of the waveguide 100 may be planar, where each layeris a thin rectangular prism. Further, the layers are stacked on top ofeach other to form an assembly 125, where the assembly 125 is also athin rectangular prism.

Light with a high incident angle stays within the inner core 110, whilelight with a lower incident angle is contained within the outer cladding120 and the inner core 110.

In one embodiment, a luminescent material 130 is disposed at the edgesof the waveguide 100. In this disclosure, the term “edges” refers to thedimension perpendicular to the longer dimensions of the assembly 125.For example, in FIG. 3A, the layers are shown as being horizontalplanes, while the luminescent material 130 is disposed vertically at theouter edges of the assembly 125. Typically, the “edge” corresponds tothe short dimension of the assembly 125. All of the edges form theperimeter of the waveguide 100. Thus, the term “perimeter” refers to allof the edges that comprise the assembly 125 used to create the waveguide100.

The luminescent material 130 may be any material that emits light. Forexample, in certain embodiments, the luminescent material may be aphosphor. In one particular embodiment, the phosphor emits red lightwhen excited by blue light. Phosphors include micrometer powders of zincsulfide, ZnS, or cadmium selenide, CdSe. These powders are usually mixedwith a polymer of the desired index and applied at the edges of thewaveguide 100 either in the inner core 110, the outer cladding 120 or inboth layers as the waveguide 100 is being manufactured. In someembodiments, the luminescent material 130 may be disposed within theperimeter of the waveguide 100 to secure a more sensitive area on theprinted circuit board.

FIG. 3B shows a top view of the waveguide 100, where the luminescentmaterial 130 is disposed around the entire perimeter of the waveguide100. In other words, the luminescent material 130 may be disposed on alledges of the waveguide 100. In other embodiments, the luminescentmaterial 130 may be disposed on a subset of the edges of the waveguide100. In all embodiments, the luminescent material 130 is disposed on atleast a portion of one edge of the waveguide 100. In certainembodiments, the luminescent material 130 may be disposed on at least aportion of several edges of the waveguide 100. The thickness of theluminescent material 130 may vary, and may be between 10 micrometers and2 millimeters.

In another embodiment, also shown in FIG. 3B, luminescent material 131may be disposed within the inner core 110, the outer cladding 120 orboth layers. In other words, the luminescent material 131 is disposedwithin the perimeter of the waveguide 100.

Further, in certain embodiments, the luminescent material 130 may bedisposed along at least part of the perimeter and luminescent material131 is also disposed within the perimeter of the waveguide 100.

FIG. 4 shows the waveguide 100 disposed on a printed circuit board. Theprinted circuit board includes a blue light source 410, which may be oneor more blue LEDs. The printed circuit board also includes an imagesensor 420. Blue light 411 enters the waveguide 100 from the blue lightsource 410 and traverses the waveguide 100. When the blue light 411reaches the edges of the waveguide 100, the blue light 411 strikes theluminescent material 130, which, in this embodiment, is disposed aroundthe perimeter of the waveguide 100. The luminescent material 130 thenemits red light 412. Both the blue light 411 and the red light 412 reachthe image sensor 420 and combine to create the reflected light pattern.In certain embodiments, an optical filter 421 may be disposed betweenthe waveguide 100 and the image sensor 420. The optical filter 421 mayattenuate the blue light 411 to more closely match the intensities ofthe blue light 411 and the red light 412. In certain embodiments, theimage sensor 420 may be a color image sensor, such as a CCD imagesensor.

In the event that a probe 430 penetrates the waveguide 100, it reflectssome of the blue light 411 emitted from the blue light source 410 towardthe image sensor 420 as reflected light 432. However, in addition, italso casts a shadow 431 downstream from the blue light source 410.

Wherever the shadow 431 extends to the perimeter, the luminescentmaterial 130 will not be excited, and therefore will not emit any redlight 412. Thus, the amount of red light 412 that is produced isaffected by the intrusion of the probe 430. Therefore, two differentphenomenons are employed to increase the sensitivity of the reflectedlight pattern to intrusion. First, the path of the originally emittedblue light 411 may be reflected, deflected or blocked by the probe 430.Additionally, the production of red light 412 may be altered by thecreation of shadows by the probe 430. These two mechanisms create a muchgreater change in the reflected light pattern captured by the imagesensor 420 than is achieved in the prior art.

Further, in certain embodiments, multiple blue light sources 410,disposed at different locations, may be used to further increase theeffect that an inserted probe may have in the reflected image sensor.

As explained above, in certain embodiments, the luminescent material maybe disposed within the perimeter of the waveguide 100, so as to createadditional light sources within the waveguide 100. This may be inaddition to, or instead of, the luminescent material disposed along theperimeter.

While the above disclosure describes the use of blue light sources 410with luminescent material 130 that generates red light, otherembodiments are also possible. For example, in certain embodiments, thelight sources 410 emit a light having a first wavelength. Theluminescent material 130 absorbs the light having the first wavelength,and emits a light having a second wavelength. In certain embodiments,the second wavelength is greater than the first wavelength.

FIG. 5A shows a cross section of a printed circuit board having thewaveguide 100 of FIG. 3A. FIG. 5B shows a top view of the printedcircuit board. As shown in FIG. 5A, the waveguide 100 is disposed on topof the printed circuit board 500. A blue light source 410 is used toinject light into the waveguide 100. The reflected light is received byan image sensor 420, disposed on the printed circuit board 500, separatefrom the blue light source 410. FIG. 5B shows a top view of the printedcircuit board 500. In certain embodiments, the waveguide 100 (shown indashed lines) is used to cover several components disposed on theprinted circuit board 500. Disposed on the printed circuit board is amemory element 513 that contains the code executed by the processingunit 514. In operation, the code in the memory element 513 may beencrypted, where the key needed to decrypt the code is defined by thelight pattern at the image sensor 420. In some embodiments, a decryptioncircuit 515 is also disposed on the printed circuit board 500. Thedecryption circuit 515 uses the light pattern from the image sensor 420as the key to decrypt the encrypted code, and then passes this decryptedcode to the processing unit 514. To protect the security andconfidentiality of the code, certain components on the printed circuitboard 500 are covered by the waveguide 100. For example, the processingunit 514, which receives the decrypted code, may be covered by thewaveguide 100. In addition, the decryption circuit 515, which outputsdecrypted code, may also be covered by the waveguide 100. The memoryelement 513 may optionally also be covered by the waveguide 100. Inother words, decrypted code and the light pattern output from the imagesensor 420 remain hidden under the waveguide 100. Additionally, the bluelight source 410 and the image sensor 420 are located beneath thewaveguide 100.

In this way, if one were to attempt to interrogate the printed circuitboard 500 to gain access to the decrypted code, one would necessarilyhave to pierce or remove the waveguide 100. However, any manipulation ofthe waveguide 100 will affect the way that light is reflected within thewaveguide 100, thereby affecting the light pattern received at the imagesensor 420, as described above. This change in the light patternmodifies the key, and renders the circuit unusable. Thus, the waveguideof FIGS. 3A-3B may be used to create a physically unclonable function(PUF) on a printed circuit board.

The present disclosure is not to be limited in scope by the specificembodiments described herein. Indeed, other various embodiments of andmodifications to the present disclosure, in addition to those describedherein, will be apparent to those of ordinary skill in the art from theforegoing description and accompanying drawings. Thus, such otherembodiments and modifications are intended to fall within the scope ofthe present disclosure. Furthermore, although the present disclosure hasbeen described herein in the context of a particular implementation in aparticular environment for a particular purpose, those of ordinary skillin the art will recognize that its usefulness is not limited thereto andthat the present disclosure may be beneficially implemented in anynumber of environments for any number of purposes. Accordingly, theclaims set forth below should be construed in view of the full breadthand spirit of the present disclosure as described herein.

What is claimed:
 1. A physically unclonable function, comprising: aprinted circuit board; and a waveguide, disposed on the printed circuitboard, the waveguide comprising: an assembly comprising an inner core,having a first refractive index; and an outer cladding, covering atleast a portion of the inner core, having a second refractive index,wherein the assembly forms a thin rectangular prism; and a luminescentmaterial disposed on an interior of the assembly; wherein the printedcircuit board comprises: a light source for emitting a light into thewaveguide; an image sensor for receiving a light pattern created by thelight traversing the waveguide; a processing unit; a memory elementcontaining encrypted code to be executed by the processing unit; and adecryption circuit to decrypt the encrypted code stored in the memoryelement, wherein the light pattern is used to create a key used by thedecryption circuit.
 2. The physically unclonable function of claim 1,wherein the processing unit and the decryption circuit are disposedbeneath the waveguide.
 3. The physically unclonable function of claim 1,wherein the memory element is disposed beneath the waveguide.
 4. Thephysically unclonable function of claim 1, wherein the light sourceemits light having a first wavelength, and the luminescent materialabsorbs the light having the first wavelength, and emits light having asecond wavelength, greater than the first wavelength.
 5. The physicallyunclonable function of claim 1, wherein the light source comprises ablue light source.
 6. The physically unclonable function of claim 1,wherein the luminescent material is a phosphor that absorbs blue lightand emits red light.
 7. The physically unclonable function of claim 1,further comprising an optical filter disposed between the waveguide andthe image sensor.
 8. The physically unclonable function of claim 1,wherein the image sensor is a color image sensor.
 9. The physicallyunclonable function of claim 1, wherein the luminescent material isdisposed on an entire perimeter of the assembly.
 10. The physicallyunclonable function of claim 1, wherein the luminescent material isdisposed within the inner core.
 11. The physically unclonable functionof claim 1, wherein the luminescent material is disposed within theouter cladding.